Embracing the AI Revolution in EDA: Powering the Future of Circuit Design
Abstract: 
The landscape of electronic design automation (EDA) is undergoing a profound transformation, driven by the rapid advancements in artificial intelligence (AI) and machine learning (ML) technologies. As the industry seeks to address the growing complexity of circuit design, the integration of AI-powered tools has become a crucial enabler, promising to reshape the way engineers approach the design, implementation, and optimization of electronic systems. In this keynote, we will explore the compelling ways in which AI and ML are being leveraged within the EDA ecosystem, and how these innovative approaches are poised to redefine the future of circuit design. Drawing from real-world examples and case studies, we will delve into the specific applications of AI in various stages of the design flow, showcasing tangible improvements in productivity, efficiency, and design quality. Join us as we embark on an enlightening journey to uncover the remarkable ways in which AI is reshaping the landscape of electronic design automation, paving the way for a more efficient, innovative, and future-ready circuit design ecosystem.
Biography: Dr. Farshad Baharvand received his B.Sc. and M.Sc., both in computer engineering, from the University of Tehran, in 1993 and 1996, respectively. Since then, he has worked for the local and international microelectronic industries in various roles and co-founded a fabless semiconductor startup in 2003. During his professional activities, Dr. Baharvand has developed several ASIC/SoC chips on different process technologies, realizing multicore processors, high-speed interfaces, security accelerators, special-purpose microcontrollers, and digital signal processors for a variety of applications. He received his Ph.D. in computer engineering from Sharif University of Technology in 2016 and has collaborated with the aforementioned universities as an adjunct professor in the past few years. In 2021, he founded TAF Microelectronics, another privately held startup specializing in the development of ASICs and IP cores for AI and IoT applications. He currently serves as CEO of TAF Microelectronics.
Micro-Electronics in Medicine
Abstract: 
In this talk use of some introduced Electronics/Microelectronics techniques, structures, and circuits for a few selected medical instruments are elaborated such as Real-time PCR (Polymerase Chain Reaction), Ultrasonography (transmit and receive circuits), and Cardiac AED (Automated External Defibrillator). Also, use of some proposed Microelectronics techniques, structures, and Integrated circuits for most utilized implantable/wearable medical devices are introduced and explained such as Cardiac pacemaker, ILR (Implantable Loop Recorder), and Neuromodulators. While the emphasis will be on details of the used circuitries, the medical system specification requirements for those specialized designed circuits are also highlighted.
Biography: Prof. Omid Shoaei received the B.Sc. and M.Sc. degrees from the University of Tehran, Iran, in 1986 and 1989, respectively, and the Ph.D. degree from Carleton University, Ottawa, ON, Canada, in 1996, all in electrical engineering. In 1995, he was with Philsar Electronics, Inc., Ottawa, working on the design of a bandpass delta-sigma data converter. From December 1995 to February 2000, he was a Member of Technical Staff with Bell Labs, Lucent Technologies, Allentown, PA, USA, where he was involved in the design of mixed analog/digital integrated circuits for LAN and Fast Ethernet systems. From February 2000 to March 2003, he was with the Design Center, Valence Semiconductor, Inc., Dubai, United Arab Emirates, as the Director of the Mixed-Signal Group, where he has been working on pipelined and delta-sigma analog-to-digital converters. From January 2008 to February 2012, he was Qualcomm, San Diego, CA, USA, where he was the chip lead and a supervisor of a team of about 20 designers for two codec development projects for smart phone, and tablet OEMs. Since January 2014, he has been the Principal Investigator of the Deep Brain Stimulator (DBS) Project supported by the CSTC. He is currently working on the development of a new IC generation for DBS with the University of Tehran. He joined the Department of Electrical and Computer Engineering, University of Tehran, as a faculty member from 1999 where is a professor now. He has received three U.S. patents, and has authored or coauthored more than 190 international and national journal and conference publications. His research interests include biomedical integrated circuits and systems, analog-to-digital converters, precision analog/mixed-signal circuits and systems, and automotive electronics.
Quantum technology and the future of classical microelectronics
Abstract: 
By reaching the high maturity limits of classical microelectronic technologies based on semiconductors, the integration of quantum technologies is currently one of the most anticipated developments for modern wide applications. The quantum phenomenon is the basis of the operation of most modern technologies such as nanotechnologies, lasers, transistors, and medical imaging systems such as MRI. The introduction of these technologies into human life is called "the first quantum revolution". With the remarkable progress of mankind in harnessing, measuring, and using devices in very small dimensions as well as reaching very low temperatures and very short times, it is now possible to use the quantum properties of elements in a controlled way. These capabilities form "quantum technologies". Today, quantum technology is also referred to as the second quantum revolution.
Although economic applications and widespread use of quantum technologies are still several years away, there is no doubt that when they are implemented on a large scale, they will have a tremendous impact on technology. In May 2018, the head of quantum computing at Intel Technology Corporation suggested that "if in 10 years we have a quantum computer with a few thousand qubits, it will certainly change the world in the same way that the first microprocessor did". This is a goal which is not that far today. This is while the quantum technology is expected to eventually have wide-ranging effects for strategic and informational applications and even law. In this field, superconducting quantum computers are far ahead of other technologies in the world. Superconducting quantum computers refer to quantum computers with superconducting qubits and superconducting electronic circuits, where the qubit or quantum bit is the main unit of information in the quantum computer, which is similar to a bit in a standard computer. Superconducting quantum bits are measured by one of three main quantities: phase, charge, and flux. To implement each quantum bit, two quantum states |0⟩ and |1⟩ must be attributed to different states of the physical system. Currently, many organizations are active in this field, the most prominent of which are Google, IBM, Imec, BBN Technologies, Rigetti, and Intel companies. Developments in the last two decades have led to the growth and development of quantum systems from investigating the performance of isolated quantum systems to multi-bit quantum processors.
The great growth of this technology has caused the emergence of side issues related to engineering such as the design, control and readout of systems with multiple quantum bits, and has created a new concept called quantum engineering, which links basic knowledge, mathematics, and computer science to issues raised in engineering. Quantum computing is likely to provide other ground-breaking applications, although it is too early in the research and development phase to predict what inventions lie ahead. Quantum computing does not completely replace classical computing methods which is based on transistors and silicon microchips. Instead, quantum computing should be considered as an alternative, complementary, and even synergistic technology capable of solving some of the problems that current classical microelectronic computers are unable to solve.
Biography: Mehdi Fardmanesh received the B.S. degree in electrical engineering from Amirkabir (Tehran Polytechnic) University, Tehran, Iran, in 1987, and the M.S. and Ph.D. degrees in electrical engineering from Drexel University, Philadelphia, PA, in 1991, and 1993 (degree awarded in 1994), respectively. Until 1993, he conducted research on development of thin- and thick-film high-temperature superconducting materials, devices, and development of ultralow-noise cryogenic characterization systems at Drexel University, where he also taught electronics circuits. From 1994 to 1996, he was the Principal Manager for research and development and the Director of a private-sector research electrophysics laboratory while also teaching in the EE and Physics departments of Sharif University of Technology, in Tehran. In 1996, he joined the EEE Department of Bilkent University, in Ankara, Turkey, teaching in the areas of solid state and electronics while also supervising his established Superconductivity Research Laboratory at Bilkent. In 1998 and 1999, he was also invited to ISI-Forschungszentrum Juelich, Juelich, Germany, where he pursued the development of low-noise high-Tc radio frequency superconducting-quantum-interference-device (SQUID)-based magnetic sensors. Following establishing an international collaboration between Bilkent University and Juelich Research Center in Germany, from 2000 to 2004, he was the director of the joint project for the development of high-resolution high-Tc SQUID-based magnetic imaging system (SQUID microscope) for biomedical applications. In 2002, he reestablished his activities with the EE Department of Sharif University, where he is a tenured professor being presently vice chair for research affairs and director of EE_SUT Converging Technology Program and head of the superconductivity and advanced devices laboratory, which he established in 2003 and he has directed since then. He teaches courses in the field of Solid state Physics, and Electronic Devices, Biosensors as well as Electronics and Bio-electronic Circuits nationally and internationally. His research interests have been mainly on the design, fabrication, and modeling of superconductive, semiconducting, and 2D materials based devices and circuits, in the areas of IR-radiation sensors, bolometers, THz detectors and absorbers, microwave devices, Josephson junctions, RSFQ circuits, SQUID-based systems such as Non-Distructive Evaluation (NDE) and Magneto-Cardiography (MCG). In addition to the research interests in above, he has been pursuing research in the fields of Quantum and superconducting Qubits as well as bioelectronics such as works on design and fabrication of micro fluidic chips for cell characterizations and sorting, noninvasive glucometry, “Design of self-powered artificial retina”, “design and development of MicroElectrodeArrays (MEA)”, and “DNA conductivity characterization and analysis” in addition to Bio-thermal and THz imaging using superconductive boloemeters, 2D materials based biosensors and bio-devices. He has expertise in ultra-low noise circuitry and characterizations, cryogenic systems, vacuum technology, and thin-film fabrication technologies such as MOD, CVD, PVD, Sputtering, and PLD.
After RTL, what is next and where do we go from here?
Abstract: 
The various levels of abstraction play a crucial role in the design and description of digital hardware systems. These levels, ranging from high-level system modeling to low-level hardware description, help manage the complexity and enhance the efficiency of the design process. RTL (Register Transfer Level) has matured and has been widely adopted in digital design and simulation. However, as systems have become more complex, the limitations of RTL have become apparent, necessitating a higher level of abstraction. Modern systems comprise numerous modules and intricate components, which require a more advanced approach to manage and design them efficiently. As a result, new methodologies and EDA (Electronic Design Automation) tools are required to address these challenges. These tools and methodologies aim to elevate the level of abstraction and simplify the design process, enabling engineers to use high-level modeling techniques high-level description languages to design complex systems. This not only reduces design time but also allows for more accurate system verification and simulation. EDA tools that support these methodologies offer enhanced capabilities and features for designing and optimizing digital circuits, helping engineers effectively tackle the challenges posed by increasingly complex designs.
This talk initially gives a history of how digital system design has changed in the last 50 years and how significant RTL hardware description languages have helped this evolution. We then turn our attention to the new requirements for design of electronic components and devices. New languages and design and evaluation platforms will be discussed. The discussion will focus on the need for future tools and methodologies.
Biography: Dr. Zainalabedin Navabi is a professor of ECE at the University of Tehran. He is the author of several textbooks and computer-based trainings on VHDL, Verilog and related tools and environments. Dr. Navabi’s involvement with hardware description languages (HDL) begins in 1976, when he started formal definition of a register transfer level HDL and development of a simulator for it. In 1981 he completed the development of a synthesis tool for that same HDL. The synthesis tool generated MOS layout from an RTL description. Since 1981, Dr. Navabi has been involved in the design, definition, and implementation of Hardware Description Languages and design methodologies. His work on HDLs has continued to languages used today for system-level design and modeling and language-based design space exploration (DSE) methodologies. New domain-specific languages and methodologies for AI and ML are part of his on-going work.
Practical Microchip Fabrication Processes
1. Overview of Microchip Fabrication
2. Introduction to the Cleanroom and Its Operational Requirements
3. OSAT, Back-End, and Front-End Processes
4. Practical microchip fabrication processes including: Cleaning, Oxidation, Lithography, Etching, Doping, Metallization, Packaging and Testing
Presenter:
Dr. Nima Arjmand; Microelectronics Research Institute, Tarbiat Modares University
Eng. Ali Borzger; Microelectronics Research Institute, Tarbiat Modares University
